Apple has signed a multiyear agreement worth more than $30 billion with Broadcom to manufacture advanced wireless chips in the United States, deepening its investment in domestic semiconductor production as it seeks to strengthen supply chain resilience and reduce dependence on overseas manufacturing.
The agreement, which runs through 2031, covers the production of more than 15 billion custom wireless chips that will power future generations of Apple devices. The chips include radio frequency components and FBAR filters that support critical wireless functions such as 5G connectivity, Wi-Fi, Bluetooth and GPS across the company’s product lineup.
To support the deal, Broadcom will invest $1.5 billion in expanding and modernising its semiconductor manufacturing facility in Fort Collins, Colorado. The project is expected to boost domestic chip production while creating additional high-skilled manufacturing jobs as demand for advanced connectivity components continues to grow.
The agreement represents Apple’s largest disclosed manufacturing commitment under its broader $600 billion US investment programme, which includes expanding domestic semiconductor production, advanced manufacturing and research activities. The company has steadily increased spending on US suppliers as policymakers push to strengthen the country’s semiconductor industry and reduce reliance on foreign production.
Although Apple designs many of its own processors, it continues to rely on specialised suppliers such as Broadcom for wireless connectivity chips used across the iPhone, iPad, Mac, Apple Watch and other devices. The new agreement reinforces Broadcom’s position as one of Apple’s most important semiconductor partners at a time when the company is bringing more chip design capabilities in-house.
Apple Chief Executive Tim Cook said the partnership reflects the company’s commitment to American innovation and manufacturing, adding that the advanced components produced in Colorado are essential to delivering the performance and connectivity customers expect from Apple products.
The latest announcement builds on Apple’s broader effort to establish a more diversified semiconductor supply chain. In recent years, the company has committed to sourcing chips from new manufacturing facilities operated by suppliers including TSMC, GlobalWafers, Intel and Amkor Technology as part of its strategy to expand domestic production capacity.
The expanded partnership also provides reassurance to investors as Apple continues balancing its growing in-house chip design ambitions with long-term relationships with specialist suppliers. For Broadcom, the deal secures one of its largest customers through the end of the decade, while for Apple it reinforces a strategy of strengthening critical component supplies without relocating the assembly of most of its consumer devices from Asia.
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Emmanuel Abara Benson is a business journalist and editor covering artificial intelligence, global markets, and emerging technology.
He has previously worked with Business Insider Africa and Nairametrics, reporting on finance, startups, and innovation.
His work focuses on AI, digital economy, and global tech trends.
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